[372PC Stock]
- Nimewo Pati:
- A016768-01-K1
- Manifakti:
- Laird Technologies - Thermal Materials
- Detaye deskripsyon:
- TFLEX 3200 0.05X1.5.
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - Kousinen, Dra, Tèmik - Pwodwi pou Telefòn, DC Fans, Tèmik - Likid Refwadisman, Fanatik AC, Fanatik - Pwodwi pou Telefòn, Fanatik - Pwodwi pou Telefòn - Fil Fan and Tèmik - tèrmoelèktrik, asanble Peltier ...
- Avantaj konpetitif:
- We specialize in Laird Technologies - Thermal Materials A016768-01-K1 electronic components. A016768-01-K1 can be shipped within 24 hours after order. If you have any demands for A016768-01-K1, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
A016768-01-K1 Atribi pwodwi yo
Nimewo Pati :
A016768-01-K1
Manifakti :
Laird Technologies - Thermal Materials
Deskripsyon :
TFLEX 3200 0.05X1.5
Seri :
-
Estati Pati :
Active
Itilizasyon :
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Kalite :
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Fòm :
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Deskripsyon :
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Pesè :
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Materyèl :
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Adezif :
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Fè bak, Carrier :
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Koulè :
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Rezistivite tèmik :
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Konductivite tèmik :
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Dènye nouvèl
Ou ka enterese tou
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PL-1-1-254
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THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 1.0mm Thickness, 25.4x25.4mm, Grey
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PL-05-5-1016-H
Wakefield-Vette
THERM PAD 101.6MMX101.6MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 0.5mm Thickness, 101.6x1016mm, Gold, Hyper Soft
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