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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
  1. Lakay
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  5. SP400-0.009-00-54

Bergquist - SP400-0.009-00-54

KEY Part #: K6149308

SP400-0.009-00-54 Pricing (USD) [719394PC Stock]

  • 1 pcs$0.07910
  • 10 pcs$0.07119
  • 50 pcs$0.06375
  • 100 pcs$0.05640
  • 500 pcs$0.04904
  • 1,000 pcs$0.03678
  • 5,000 pcs$0.03188
Nimewo Pati:
SP400-0.009-00-54
Manifakti:
Bergquist
Detaye deskripsyon:
THERM PAD 19.05MMX12.7MM GRAY. Thermal Interface Products The Original Sil-Pad Material, 0.009" Thickness, 19.05x12.7x4.75x3.73mm, Sil-Pad TSP 900 Series / Also Known as Bergquist Sil-Pad 400 Series
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - tiyo Chalè, Cham vapè, Fanatik - Pwodwi pou Telefòn - Fil Fan, Tèmik - Likid Refwadisman, Tèmik - adezif, epoksi, grès, kole, Tèmik - lavabo yo, DC Fans, Fanatik AC and Fanatik - Pwodwi pou Telefòn ...
Avantaj konpetitif:
We specialize in Bergquist SP400-0.009-00-54 electronic components. SP400-0.009-00-54 can be shipped within 24 hours after order. If you have any demands for SP400-0.009-00-54, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

SP400-0.009-00-54 Atribi pwodwi yo

Nimewo Pati : SP400-0.009-00-54
Manifakti : Bergquist
Deskripsyon : THERM PAD 19.05MMX12.7MM GRAY
Seri : Sil-Pad® 400
Estati Pati : Active
Itilizasyon : TO-220
Kalite : Pad, Sheet
Fòm : Rectangular
Deskripsyon : 19.05mm x 12.70mm
Pesè : 0.0090" (0.229mm)
Materyèl : Silicone Rubber
Adezif : -
Fè bak, Carrier : Fiberglass
Koulè : Gray
Rezistivite tèmik : 1.40°C/W
Konductivite tèmik : 0.9 W/m-K

Dènye nouvèl

Bergquist Company GAP PAD HC 5.0 Thermal Interface
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