Laird Technologies - Thermal Materials - A17879-03

KEY Part #: K6150556

A17879-03 Pricing (USD) [802PC Stock]

  • 1 pcs$57.85751

Nimewo Pati:
A17879-03
Manifakti:
Laird Technologies - Thermal Materials
Detaye deskripsyon:
TFLEX HD330MTG 17.5X18.
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Fanatik AC, Tèmik - adezif, epoksi, grès, kole, Tèmik - Kousinen, Dra, DC Fans, Tèmik - Likid Refwadisman, Tèmik - lavabo yo, Tèmik - tèrmoelèktrik, asanble Peltier and Tèmik - adezif, epoksi, grès, kole ...
Avantaj konpetitif:
We specialize in Laird Technologies - Thermal Materials A17879-03 electronic components. A17879-03 can be shipped within 24 hours after order. If you have any demands for A17879-03, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

A17879-03 Atribi pwodwi yo

Nimewo Pati : A17879-03
Manifakti : Laird Technologies - Thermal Materials
Deskripsyon : TFLEX HD330MTG 17.5X18
Seri : Tflex™ HD300
Estati Pati : Active
Itilizasyon : -
Kalite : Gap Filler Pad, Sheet
Fòm : Rectangular
Deskripsyon : 457.20mm x 444.50mm
Pesè : 0.0300" (0.762mm)
Materyèl : Silicone Elastomer
Adezif : Tacky - Both Sides
Fè bak, Carrier : Liner
Koulè : Pink
Rezistivite tèmik : -
Konductivite tèmik : 2.7 W/m-K