t-Global Technology - L37-5-150-150-3.0-1A

KEY Part #: K6153181

L37-5-150-150-3.0-1A Pricing (USD) [7188PC Stock]

  • 1 pcs$5.73351
  • 10 pcs$5.41532
  • 25 pcs$5.09661
  • 50 pcs$4.77807
  • 100 pcs$4.45953
  • 250 pcs$4.14099
  • 500 pcs$4.06136
  • 1,000 pcs$3.98172

Nimewo Pati:
L37-5-150-150-3.0-1A
Manifakti:
t-Global Technology
Detaye deskripsyon:
THERM PAD 150MMX150MM W/ADH GRAY.
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - Likid Refwadisman, Tèmik - adezif, epoksi, grès, kole, Tèmik - lavabo yo, Tèmik - tèrmoelèktrik, asanble Peltier, Tèmik - adezif, epoksi, grès, kole, Fanatik - Pwodwi pou Telefòn - Fil Fan, Fanatik AC and Tèmik - tiyo Chalè, Cham vapè ...
Avantaj konpetitif:
We specialize in t-Global Technology L37-5-150-150-3.0-1A electronic components. L37-5-150-150-3.0-1A can be shipped within 24 hours after order. If you have any demands for L37-5-150-150-3.0-1A, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

L37-5-150-150-3.0-1A Atribi pwodwi yo

Nimewo Pati : L37-5-150-150-3.0-1A
Manifakti : t-Global Technology
Deskripsyon : THERM PAD 150MMX150MM W/ADH GRAY
Seri : L37-5
Estati Pati : Active
Itilizasyon : -
Kalite : Conductive Pad, Sheet
Fòm : Square
Deskripsyon : 150.00mm x 150.00mm
Pesè : 0.118" (3.00mm)
Materyèl : Silicone Elastomer
Adezif : Adhesive - One Side
Fè bak, Carrier : -
Koulè : Gray
Rezistivite tèmik : -
Konductivite tèmik : 1.6 W/m-K

Ou ka enterese tou
  • PL-2-1-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-126

    Wakefield-Vette

    THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole

  • CD-02-05-C-20

    Wakefield-Vette

    THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole

  • CD-02-05-REC-125-N

    Wakefield-Vette

    THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole

  • PL-2-5-254-H

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft