DILB18P-223TLF Pricing (USD) [283397PC Stock]
- 1 pcs$0.13051
- 15,600 pcs$0.04565
- Nimewo Pati:
- DILB18P-223TLF
- Manifakti:
- Amphenol ICC (FCI)
- Detaye deskripsyon:
- CONN IC DIP SOCKET 18POS TINLEAD. IC & Component Sockets SOCKETS DIP
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: USB, DVI, koneksyon HDMI - Pwodwi pou Telefòn, Tèminal - Konektè tourèl, Modular Connectors - Wiring Blocks, Konektè Fib optik - Cartes, Pouvwa Connectors Antre - Inlets, Plòg, Modil yo, Terminals - Foil Connectors, Modular Connectors - Wiring Blocks - Pwodwi pou Te and Tèminal - Fil Koneksyon Connector ...
- Avantaj konpetitif:
- We specialize in Amphenol ICC (FCI) DILB18P-223TLF electronic components. DILB18P-223TLF can be shipped within 24 hours after order. If you have any demands for DILB18P-223TLF, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
DILB18P-223TLF Atribi pwodwi yo
Nimewo Pati :
DILB18P-223TLF
Manifakti :
Amphenol ICC (FCI)
Deskripsyon :
CONN IC DIP SOCKET 18POS TINLEAD
Seri :
DILB
Estati Pati :
Active
Kalite :
DIP, 0.3" (7.62mm) Row Spacing
Nimewo nan pozisyon oswa Pins (gri) :
18 (2 x 9)
Pitch - kwazman :
0.100" (2.54mm)
Kontakte Fini - Kwazman :
Tin-Lead
Kontakte fini epesè - kwazman :
100.0µin (2.54µm)
Kontakte materyèl - kwazman :
Copper Alloy
Mounting Kalite :
Through Hole
Karakteristik :
Open Frame
Revokasyon :
Solder
Pitch - Post :
0.100" (2.54mm)
Kontakte Fini - Post :
Tin-Lead
Kontakte Fini Epesè - Post :
100.0µin (2.54µm)
Kontakte Materyèl - Post :
Copper Alloy
Materyèl Lojman :
Polyamide (PA), Nylon
Operating Tanperati :
-55°C ~ 125°C
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