Nimewo Pati :
APF30-30-13CB
Manifakti :
CTS Thermal Management Products
Deskripsyon :
HEATSINK LOW-PROFILE FORGED
Pake refwadi :
Assorted (BGA, LGA, CPU, ASIC...)
Metòd Atachman :
Thermal Tape, Adhesive (Not Included)
Wotè Off Sèvi (Tay nan Fin) :
0.500" (12.70mm)
Disipasyon pouvwa @ monte tanperati :
-
Rezistans tèmik @ fòse Air koule :
2.50°C/W @ 200 LFM
Rezistans tèmik @ natirèl :
-
Materyèl Fini :
Black Anodized