Aavid, Thermal Division of Boyd Corporation - 6030D(COPPER)G

KEY Part #: K6265588

6030D(COPPER)G Pricing (USD) [76032PC Stock]

  • 1 pcs$0.52262
  • 10 pcs$0.49712
  • 25 pcs$0.48416
  • 50 pcs$0.47112
  • 100 pcs$0.44490
  • 250 pcs$0.41874
  • 500 pcs$0.39256
  • 1,000 pcs$0.34659
  • 5,000 pcs$0.33421

Nimewo Pati:
6030D(COPPER)G
Manifakti:
Aavid, Thermal Division of Boyd Corporation
Detaye deskripsyon:
BOARD LEVEL HEAT SINK. Heat Sinks Board Level Stamped Heatsink for TO-220, Vertical Mounting, 12.5 Degree C/W Thermal Resistance
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - Thermoelectric, Peltier Modules, Tèmik - adezif, epoksi, grès, kole, Fanatik AC, Tèmik - adezif, epoksi, grès, kole, DC Fans, Tèmik - Likid Refwadisman, Tèmik - Kousinen, Dra and Tèmik - tiyo Chalè, Cham vapè ...
Avantaj konpetitif:
We specialize in Aavid, Thermal Division of Boyd Corporation 6030D(COPPER)G electronic components. 6030D(COPPER)G can be shipped within 24 hours after order. If you have any demands for 6030D(COPPER)G, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

6030D(COPPER)G Atribi pwodwi yo

Nimewo Pati : 6030D(COPPER)G
Manifakti : Aavid, Thermal Division of Boyd Corporation
Deskripsyon : BOARD LEVEL HEAT SINK
Seri : -
Estati Pati : Active
Kalite : Board Level, Vertical
Pake refwadi : TO-220
Metòd Atachman : Bolt On and PC Pin
Fòm : Rectangular, Fins
Longè : 1.180" (29.97mm)
Lajè : 1.000" (25.40mm)
Dyamèt : -
Wotè Off Sèvi (Tay nan Fin) : 0.500" (12.70mm)
Disipasyon pouvwa @ monte tanperati : 1.0W @ 20°C
Rezistans tèmik @ fòse Air koule : 6.00°C/W @ 300 LFM
Rezistans tèmik @ natirèl : 12.50°C/W
Materyèl : Copper
Materyèl Fini : Tin

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