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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
  1. Lakay
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  3. Fanatik, tèmik Jesyon
  4. Tèmik - Kousinen, Dra
  5. SP900S-0.009-00-12

Bergquist - SP900S-0.009-00-12

KEY Part #: K6149401

SP900S-0.009-00-12 Pricing (USD) [261964PC Stock]

  • 1 pcs$0.14190
  • 1,051 pcs$0.14119
Nimewo Pati:
SP900S-0.009-00-12
Manifakti:
Bergquist
Detaye deskripsyon:
THERM PAD 6.35MM DIA PINK. Thermal Interface Products High Performance Insulator for Low-Pressure Applications, 0.009" Thickness, Sil-Pad TSP 1600S Series / Also Known as Bergquist Sil-Pad 900S Series
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Fanatik - Pwodwi pou Telefòn - Fil Fan, Tèmik - Kousinen, Dra, DC Fans, Fanatik AC, Tèmik - tèrmoelèktrik, asanble Peltier, Tèmik - tiyo Chalè, Cham vapè, Tèmik - adezif, epoksi, grès, kole and Fanatik - Pwodwi pou Telefòn ...
Avantaj konpetitif:
We specialize in Bergquist SP900S-0.009-00-12 electronic components. SP900S-0.009-00-12 can be shipped within 24 hours after order. If you have any demands for SP900S-0.009-00-12, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

SP900S-0.009-00-12 Atribi pwodwi yo

Nimewo Pati : SP900S-0.009-00-12
Manifakti : Bergquist
Deskripsyon : THERM PAD 6.35MM DIA PINK
Seri : Sil-Pad® 900-S
Estati Pati : Active
Itilizasyon : TO-18
Kalite : Pad, Sheet
Fòm : Round
Deskripsyon : 6.35mm Dia
Pesè : 0.0090" (0.229mm)
Materyèl : Silicone Rubber
Adezif : -
Fè bak, Carrier : Fiberglass
Koulè : Pink
Rezistivite tèmik : 0.61°C/W
Konductivite tèmik : 1.6 W/m-K

Dènye nouvèl

Bergquist Company GAP PAD HC 5.0 Thermal Interface
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