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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
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  5. GPHC5.0-0.080-02-0816

Bergquist - GPHC5.0-0.080-02-0816

KEY Part #: K6152787

GPHC5.0-0.080-02-0816 Pricing (USD) [604PC Stock]

  • 1 pcs$76.78757
  • 10 pcs$72.27150
  • 50 pcs$67.75444
Nimewo Pati:
GPHC5.0-0.080-02-0816
Manifakti:
Bergquist
Detaye deskripsyon:
THERM PAD 406.4MMX203.2MM VIOLET. Thermal Interface Products BERGQUIST GAP PAD TGP HC5000
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - Kousinen, Dra, Tèmik - adezif, epoksi, grès, kole, DC Fans, Tèmik - tiyo Chalè, Cham vapè, Tèmik - Likid Refwadisman, Tèmik - Thermoelectric, Peltier Modules, Tèmik - adezif, epoksi, grès, kole and Tèmik - Pwodwi pou Telefòn ...
Avantaj konpetitif:
We specialize in Bergquist GPHC5.0-0.080-02-0816 electronic components. GPHC5.0-0.080-02-0816 can be shipped within 24 hours after order. If you have any demands for GPHC5.0-0.080-02-0816, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

GPHC5.0-0.080-02-0816 Atribi pwodwi yo

Nimewo Pati : GPHC5.0-0.080-02-0816
Manifakti : Bergquist
Deskripsyon : THERM PAD 406.4MMX203.2MM VIOLET
Seri : Gap Pad® HC 5.0
Estati Pati : Active
Itilizasyon : -
Kalite : Pad, Sheet
Fòm : Rectangular
Deskripsyon : 406.40mm x 203.20mm
Pesè : 0.0800" (2.032mm)
Materyèl : -
Adezif : Tacky - Both Sides
Fè bak, Carrier : Fiberglass
Koulè : Violet
Rezistivite tèmik : -
Konductivite tèmik : 5.0 W/m-K

Dènye nouvèl

Bergquist Company GAP PAD HC 5.0 Thermal Interface
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