[13694PC Stock]
- Nimewo Pati:
- DIP050-628-157BLF
- Manifakti:
- Amphenol ICC (FCI)
- Detaye deskripsyon:
- CONN IC DIP SOCKET 28POS TIN.
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Bannann ak Ide Konektè - adaptè, Sikilè Konektè - Housings, D-Sub, D-ki gen fòm Connectors - Kontak, Tèminal blòk - Cartes, Konèkteur Backplane - DIN 41612, Pouvwa Connectors Antre - Inlets, Plòg, Modil yo, Konnektè memwa - Pwodwi pou Telefòn and Solid Eta Lighting Connectors ...
- Avantaj konpetitif:
- We specialize in Amphenol ICC (FCI) DIP050-628-157BLF electronic components. DIP050-628-157BLF can be shipped within 24 hours after order. If you have any demands for DIP050-628-157BLF, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
DIP050-628-157BLF Atribi pwodwi yo
Nimewo Pati :
DIP050-628-157BLF
Manifakti :
Amphenol ICC (FCI)
Deskripsyon :
CONN IC DIP SOCKET 28POS TIN
Seri :
-
Estati Pati :
Obsolete
Kalite :
DIP, 0.6" (15.24mm) Row Spacing
Nimewo nan pozisyon oswa Pins (gri) :
28 (2 x 14)
Pitch - kwazman :
0.100" (2.54mm)
Kontakte Fini - Kwazman :
Tin
Kontakte fini epesè - kwazman :
100.0µin (2.54µm)
Kontakte materyèl - kwazman :
Beryllium Copper
Mounting Kalite :
Through Hole
Karakteristik :
Open Frame
Revokasyon :
Solder
Pitch - Post :
0.100" (2.54mm)
Kontakte Fini - Post :
Tin
Kontakte Fini Epesè - Post :
200.0µin (5.08µm)
Kontakte Materyèl - Post :
Brass
Materyèl Lojman :
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Tanperati :
-
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