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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
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  5. SP400-0.009-AC-64

Bergquist - SP400-0.009-AC-64

KEY Part #: K6149226

SP400-0.009-AC-64 Pricing (USD) [283397PC Stock]

  • 1 pcs$0.13117
  • 1,000 pcs$0.13051
Nimewo Pati:
SP400-0.009-AC-64
Manifakti:
Bergquist
Detaye deskripsyon:
THERM PAD 12.7MMX9.78MM W/ADH. Thermal Interface Products The Original Sil-Pad Material, 0.009" Thickness, Adhesive - One Side, Sil-Pad TSP 900 Series / Also Known as Bergquist Sil-Pad 400 Series
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - Likid Refwadisman, Tèmik - tèrmoelèktrik, asanble Peltier, Tèmik - tiyo Chalè, Cham vapè, Tèmik - Kousinen, Dra, Fanatik AC, Tèmik - adezif, epoksi, grès, kole, Tèmik - lavabo yo and DC Fans ...
Avantaj konpetitif:
We specialize in Bergquist SP400-0.009-AC-64 electronic components. SP400-0.009-AC-64 can be shipped within 24 hours after order. If you have any demands for SP400-0.009-AC-64, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

SP400-0.009-AC-64 Atribi pwodwi yo

Nimewo Pati : SP400-0.009-AC-64
Manifakti : Bergquist
Deskripsyon : THERM PAD 12.7MMX9.78MM W/ADH
Seri : Sil-Pad® 400
Estati Pati : Active
Itilizasyon : TO-220
Kalite : Pad, Sheet
Fòm : Rectangular
Deskripsyon : 12.70mm x 9.78mm
Pesè : 0.0090" (0.229mm)
Materyèl : Silicone Rubber
Adezif : Adhesive - One Side
Fè bak, Carrier : Fiberglass
Koulè : Gray
Rezistivite tèmik : 1.40°C/W
Konductivite tèmik : 0.9 W/m-K

Dènye nouvèl

Bergquist Company GAP PAD HC 5.0 Thermal Interface
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