Apex Microtechnology - TW03

KEY Part #: K6153163

TW03 Pricing (USD) [3629PC Stock]

  • 1 pcs$11.93461
  • 10 pcs$11.23039
  • 25 pcs$10.52859
  • 50 pcs$9.82659
  • 100 pcs$9.47564
  • 250 pcs$8.94921
  • 500 pcs$8.77374

Nimewo Pati:
TW03
Manifakti:
Apex Microtechnology
Detaye deskripsyon:
THERM PAD 39.37MMX26.67MM 10/PK.
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - tèrmoelèktrik, asanble Peltier, Tèmik - adezif, epoksi, grès, kole, Tèmik - Likid Refwadisman, Tèmik - Thermoelectric, Peltier Modules, Tèmik - adezif, epoksi, grès, kole, Tèmik - lavabo yo, Fanatik - Pwodwi pou Telefòn and Fanatik AC ...
Avantaj konpetitif:
We specialize in Apex Microtechnology TW03 electronic components. TW03 can be shipped within 24 hours after order. If you have any demands for TW03, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

TW03 Atribi pwodwi yo

Nimewo Pati : TW03
Manifakti : Apex Microtechnology
Deskripsyon : THERM PAD 39.37MMX26.67MM 10/PK
Seri : Apex Precision Power®
Estati Pati : Active
Itilizasyon : TO-3
Kalite : Pad, Washer
Fòm : Rhombus
Deskripsyon : 39.37mm x 26.67mm
Pesè : 0.0005" (0.013mm)
Materyèl : Phase Change Compound
Adezif : -
Fè bak, Carrier : Aluminum
Koulè : Silver
Rezistivite tèmik : -
Konductivite tèmik : -
Ou ka enterese tou
  • PL-2-1-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-126

    Wakefield-Vette

    THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole

  • CD-02-05-C-22

    Wakefield-Vette

    THERM PAD 0.846 X 0.846. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.846 Inch x 0.846 Inch, No Hole

  • CD-02-05-C-20

    Wakefield-Vette

    THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole

  • CD-02-05-REC-125-N

    Wakefield-Vette

    THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole