BDN11-3CB/A01 Pricing (USD) [34131PC Stock]
- 1 pcs$1.24277
- 10 pcs$1.21104
- 25 pcs$1.17843
- 50 pcs$1.05579
- 100 pcs$0.99370
- 250 pcs$0.93161
- 500 pcs$0.90055
- 1,000 pcs$0.80739
- 5,000 pcs$0.79186
- Nimewo Pati:
- BDN11-3CB/A01
- Manifakti:
- CTS Thermal Management Products
- Detaye deskripsyon:
- HEATSINK CPU W/ADHESIVE 1.11SQ.
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - adezif, epoksi, grès, kole, Tèmik - adezif, epoksi, grès, kole, Tèmik - Thermoelectric, Peltier Modules, Fanatik - Pwodwi pou Telefòn - Fil Fan, Tèmik - tèrmoelèktrik, asanble Peltier, Tèmik - lavabo yo, Tèmik - Pwodwi pou Telefòn and DC Fans ...
- Avantaj konpetitif:
- We specialize in CTS Thermal Management Products BDN11-3CB/A01 electronic components. BDN11-3CB/A01 can be shipped within 24 hours after order. If you have any demands for BDN11-3CB/A01, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
BDN11-3CB/A01 Atribi pwodwi yo
Nimewo Pati :
BDN11-3CB/A01
Manifakti :
CTS Thermal Management Products
Deskripsyon :
HEATSINK CPU W/ADHESIVE 1.11SQ
Seri :
BDN
Estati Pati :
Active
Kalite :
Top Mount
Pake refwadi :
Assorted (BGA, LGA, CPU, ASIC...)
Metòd Atachman :
Thermal Tape, Adhesive (Included)
Fòm :
Square, Pin Fins
Longè :
1.110" (28.19mm)
Lajè :
1.110" (28.19mm)
Dyamèt :
-
Wotè Off Sèvi (Tay nan Fin) :
0.355" (9.02mm)
Disipasyon pouvwa @ monte tanperati :
-
Rezistans tèmik @ fòse Air koule :
7.20°C/W @ 400 LFM
Rezistans tèmik @ natirèl :
20.90°C/W
Materyèl :
Aluminum
Materyèl Fini :
Black Anodized
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