Laird Technologies - Thermal Materials - A16364-09

KEY Part #: K6153665

[7166PC Stock]


    Nimewo Pati:
    A16364-09
    Manifakti:
    Laird Technologies - Thermal Materials
    Detaye deskripsyon:
    THERM PAD 457.2MMX457.2MM GRAY. Thermal Interface Products Tflex XS490 18" x 18"
    Manufacturer's standard lead time:
    Nan stok
    Lavi etajè:
    Yon ane
    Chip Soti nan:
    Hong Kong
    RoHS:
    Metòd peman:
    Chemen chajman:
    Kategori Fanmi yo:
    KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - Pwodwi pou Telefòn, Tèmik - Thermoelectric, Peltier Modules, Fanatik AC, Fanatik - Pwodwi pou Telefòn - Fil Fan, Tèmik - adezif, epoksi, grès, kole, Tèmik - tèrmoelèktrik, asanble Peltier, Tèmik - tiyo Chalè, Cham vapè and Tèmik - Kousinen, Dra ...
    Avantaj konpetitif:
    We specialize in Laird Technologies - Thermal Materials A16364-09 electronic components. A16364-09 can be shipped within 24 hours after order. If you have any demands for A16364-09, Please submit a Request for Quotation here or send us an email:
    GB-T-27922
    ISO-9001-2015
    ISO-13485
    ISO-14001
    ISO-28000-2007
    ISO-45001-2018

    A16364-09 Atribi pwodwi yo

    Nimewo Pati : A16364-09
    Manifakti : Laird Technologies - Thermal Materials
    Deskripsyon : THERM PAD 457.2MMX457.2MM GRAY
    Seri : Tflex™ XS400
    Estati Pati : Obsolete
    Itilizasyon : -
    Kalite : Gap Filler Pad, Sheet
    Fòm : Square
    Deskripsyon : 457.20mm x 457.20mm
    Pesè : 0.0900" (2.286mm)
    Materyèl : Elastomer
    Adezif : Tacky - Both Sides
    Fè bak, Carrier : Liner
    Koulè : Gray
    Rezistivite tèmik : -
    Konductivite tèmik : 2.0 W/m-K

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