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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
  1. Lakay
  2. Pwodwi yo
  3. Connectors, Interconnects
  4. Sockets pou ICS, Transistors
  5. 28-6556-30

Aries Electronics - 28-6556-30

KEY Part #: K3355788

28-6556-30 Pricing (USD) [7409PC Stock]

  • 1 pcs$5.58944
  • 8 pcs$5.56163
Nimewo Pati:
28-6556-30
Manifakti:
Aries Electronics
Detaye deskripsyon:
CONN IC DIP SOCKET 28POS GOLD. IC & Component Sockets UNIV TEST SOCKET
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Solid Eta Lighting Connectors, Terminals - Connectors Espesyalize, Sikilè Connectors - Pwodwi pou Telefòn, Tèminal - Konektè tourèl, Solid Eta Lighting Connectors - Pwodwi pou Telefòn, Konektè devwa lou - Kontak, Sockets pou ICS, Transistors - cartes and Konektè devwa lou - kadr ...
Avantaj konpetitif:
We specialize in Aries Electronics 28-6556-30 electronic components. 28-6556-30 can be shipped within 24 hours after order. If you have any demands for 28-6556-30, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

28-6556-30 Atribi pwodwi yo

Nimewo Pati : 28-6556-30
Manifakti : Aries Electronics
Deskripsyon : CONN IC DIP SOCKET 28POS GOLD
Seri : 6556
Estati Pati : Active
Kalite : DIP, 0.6" (15.24mm) Row Spacing
Nimewo nan pozisyon oswa Pins (gri) : 28 (2 x 14)
Pitch - kwazman : 0.100" (2.54mm)
Kontakte Fini - Kwazman : Gold
Kontakte fini epesè - kwazman : 30.0µin (0.76µm)
Kontakte materyèl - kwazman : Beryllium Copper
Mounting Kalite : Through Hole
Karakteristik : Open Frame
Revokasyon : Wire Wrap
Pitch - Post : 0.100" (2.54mm)
Kontakte Fini - Post : Tin
Kontakte Fini Epesè - Post : 200.0µin (5.08µm)
Kontakte Materyèl - Post : Brass
Materyèl Lojman : Polyphenylene Sulfide (PPS), Glass Filled
Operating Tanperati : -
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