[5643PC Stock]
- Nimewo Pati:
- SIP050-1X18-157BLF
- Manifakti:
- Amphenol ICC (FCI)
- Detaye deskripsyon:
- CONN SOCKET SIP 18POS TIN.
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèminal - Konektè Fil Splice, Konektè rektangilè - Arrays, Kalite Edge, mezzanin, Konèkteur Backplane - Housings, Konektè Fib optik, Terminals - Foil Connectors, Modilè Konektè - krik, FFC, FPC (Flat Fleksib) Connectors - Pwodwi pou Te and Konektè devwa lou - kadr ...
- Avantaj konpetitif:
- We specialize in Amphenol ICC (FCI) SIP050-1X18-157BLF electronic components. SIP050-1X18-157BLF can be shipped within 24 hours after order. If you have any demands for SIP050-1X18-157BLF, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
SIP050-1X18-157BLF Atribi pwodwi yo
Nimewo Pati :
SIP050-1X18-157BLF
Manifakti :
Amphenol ICC (FCI)
Deskripsyon :
CONN SOCKET SIP 18POS TIN
Seri :
SIP050-1x
Estati Pati :
Obsolete
Kalite :
SIP
Nimewo nan pozisyon oswa Pins (gri) :
18 (1 x 18)
Pitch - kwazman :
0.100" (2.54mm)
Kontakte Fini - Kwazman :
Tin
Kontakte fini epesè - kwazman :
200.0µin (5.08µm)
Kontakte materyèl - kwazman :
Beryllium Copper
Mounting Kalite :
Through Hole
Karakteristik :
Closed Frame
Revokasyon :
Solder
Pitch - Post :
0.100" (2.54mm)
Kontakte Fini - Post :
Tin
Kontakte Fini Epesè - Post :
200.0µin (5.08µm)
Kontakte Materyèl - Post :
Brass
Materyèl Lojman :
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Tanperati :
-
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