Laird Technologies - Thermal Materials - A15754-09

KEY Part #: K6150462

A15754-09 Pricing (USD) [423PC Stock]

  • 1 pcs$109.58039

Nimewo Pati:
A15754-09
Manifakti:
Laird Technologies - Thermal Materials
Detaye deskripsyon:
TFLEX SF890. Thermal Interface Products Tflex SF890 9.0x9.0IN,
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - Likid Refwadisman, Tèmik - adezif, epoksi, grès, kole, Tèmik - Kousinen, Dra, Tèmik - tiyo Chalè, Cham vapè, Fanatik AC, Fanatik - Pwodwi pou Telefòn, Tèmik - Thermoelectric, Peltier Modules and Tèmik - tèrmoelèktrik, asanble Peltier ...
Avantaj konpetitif:
We specialize in Laird Technologies - Thermal Materials A15754-09 electronic components. A15754-09 can be shipped within 24 hours after order. If you have any demands for A15754-09, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

A15754-09 Atribi pwodwi yo

Nimewo Pati : A15754-09
Manifakti : Laird Technologies - Thermal Materials
Deskripsyon : TFLEX SF890
Seri : Tflex™ SF800
Estati Pati : Active
Itilizasyon : -
Kalite : Gap Filler Pad, Sheet
Fòm : Square
Deskripsyon : 228.60mm x 228.60mm
Pesè : 0.0900" (2.286mm)
Materyèl : Non-Silicone
Adezif : Tacky - Both Sides
Fè bak, Carrier : -
Koulè : Gray
Rezistivite tèmik : 0.19°C/W
Konductivite tèmik : 7.8 W/m-K