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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
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  5. BP100-0.005-00-1112

Bergquist - BP100-0.005-00-1112

KEY Part #: K6149275

BP100-0.005-00-1112 Pricing (USD) [4845PC Stock]

  • 1 pcs$8.94632
  • 10 pcs$8.23191
  • 50 pcs$6.80881
  • 100 pcs$5.78749
  • 500 pcs$4.76617
Nimewo Pati:
BP100-0.005-00-1112
Manifakti:
Bergquist
Detaye deskripsyon:
THERM PAD 304.8MMX279.4MM W/ADH. Thermal Interface Products BERGQUIST BOND PLY TBP 850
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - Pwodwi pou Telefòn, Tèmik - lavabo yo, Tèmik - tèrmoelèktrik, asanble Peltier, Tèmik - Likid Refwadisman, Tèmik - adezif, epoksi, grès, kole, Tèmik - tiyo Chalè, Cham vapè, Fanatik AC and Fanatik - Pwodwi pou Telefòn ...
Avantaj konpetitif:
We specialize in Bergquist BP100-0.005-00-1112 electronic components. BP100-0.005-00-1112 can be shipped within 24 hours after order. If you have any demands for BP100-0.005-00-1112, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

BP100-0.005-00-1112 Atribi pwodwi yo

Nimewo Pati : BP100-0.005-00-1112
Manifakti : Bergquist
Deskripsyon : THERM PAD 304.8MMX279.4MM W/ADH
Seri : Bond-Ply® 100
Estati Pati : Active
Itilizasyon : -
Kalite : Sheet, Tape
Fòm : Rectangular
Deskripsyon : 304.80mm x 279.40mm
Pesè : 0.0050" (0.127mm)
Materyèl : Polyimide
Adezif : Adhesive - Both Sides
Fè bak, Carrier : Fiberglass
Koulè : White
Rezistivite tèmik : 0.52°C/W
Konductivite tèmik : 0.8 W/m-K

Dènye nouvèl

Bergquist Company GAP PAD HC 5.0 Thermal Interface
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