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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
  1. Lakay
  2. Pwodwi yo
  3. DRAM
  4. LPDDR4
  5. K4F6E3S4HM-GUCL

Samsung Semiconductor - K4F6E3S4HM-GUCL

KEY Part #: K7359768

[21588PC Stock]

    Nimewo Pati:
    K4F6E3S4HM-GUCL
    Manifakti:
    Samsung Semiconductor
    Detaye deskripsyon:
    16 Gb x32 4266 Mbps 1.8 / 1.1 / 1.1 V -40 ~ 125 °C 200FBGA Mass Production.
    Manufacturer's standard lead time:
    Nan stok
    Lavi etajè:
    Yon ane
    Chip Soti nan:
    Hong Kong
    RoHS:
    Metòd peman:
    Chemen chajman:
    Kategori Fanmi yo:
    KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: LPDDR4X, HBM Aquabolt, SLC Nand, LPDDR4, DDR3, MODULE, HBM Flarebolt and LPDDR3 ...
    Avantaj konpetitif:
    We specialize in Samsung Semiconductor K4F6E3S4HM-GUCL electronic components. K4F6E3S4HM-GUCL can be shipped within 24 hours after order. If you have any demands for K4F6E3S4HM-GUCL, Please submit a Request for Quotation here or send us an email:
    GB-T-27922
    ISO-9001-2015
    ISO-13485
    ISO-14001
    ISO-28000-2007
    ISO-45001-2018

    K4F6E3S4HM-GUCL Atribi pwodwi yo

    Nimewo Pati : K4F6E3S4HM-GUCL
    Manifakti : Samsung Semiconductor
    Deskripsyon : 16 Gb x32 4266 Mbps 1.8 / 1.1 / 1.1 V -40 ~ 125 °C 200FBGA Mass Production
    Seri : DDR3
    dansite : 16 Gb
    Org. : x32
    vitès : 4266 Mbps
    Voltage : 1.8 / 1.1 / 1.1 V
    Tanperatur. : -40 ~ 125 °C
    Pake : 200FBGA
    pwodwi dènye nouvèl : Mass Production

    Dènye nouvèl

    Mass Production of Fifth-Generation V-NAND has Started
    How Will 5G Impact on Memory?
    Automotive Driven by Small Packages Under the Hood
    Samsung Rolls Out Industry’s First 8GB LPDDR4 DRAM Package
    Unlocking the Power of Cloud Computing
    Evolving Mobile Solutions: Samsung at MWC 2018
    Inside the building blocks of the 5G future
    Samsung Electronics Begins Mass Production of Industry's First 12GB LPDDR4X-based uMCP
    Samsung Now Producing Industry’s Highest Density (3GB) LPDDR3 Mobile Memory for Smartphones
    High Bandwidth Memory is Catching on for Data-intensive Computing
    Bringing Artificial Intelligence to Devices Everywhere
    Autonomous Driving and the Quest for Safety
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    Pati cho