Taica North America Corporation - COH-1019LVC-200-30

KEY Part #: K6151349

COH-1019LVC-200-30 Pricing (USD) [2297PC Stock]

  • 1 pcs$18.85631

Nimewo Pati:
COH-1019LVC-200-30
Manifakti:
Taica North America Corporation
Detaye deskripsyon:
THERMAL INTERFACE PAD GAP PAD.
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Fanatik - Pwodwi pou Telefòn - Fil Fan, Tèmik - adezif, epoksi, grès, kole, Tèmik - Thermoelectric, Peltier Modules, Tèmik - Pwodwi pou Telefòn, Tèmik - Kousinen, Dra, Tèmik - tèrmoelèktrik, asanble Peltier, Tèmik - lavabo yo and Fanatik - Pwodwi pou Telefòn ...
Avantaj konpetitif:
We specialize in Taica North America Corporation COH-1019LVC-200-30 electronic components. COH-1019LVC-200-30 can be shipped within 24 hours after order. If you have any demands for COH-1019LVC-200-30, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

COH-1019LVC-200-30 Atribi pwodwi yo

Nimewo Pati : COH-1019LVC-200-30
Manifakti : Taica North America Corporation
Deskripsyon : THERMAL INTERFACE PAD GAP PAD
Seri : aGEL™ COH
Estati Pati : Active
Itilizasyon : -
Kalite : Gel Pad, Sheet
Fòm : Square
Deskripsyon : 200.00mm x 200.00mm
Pesè : 0.118" (3.00mm)
Materyèl : Silicone Gel
Adezif : Tacky - Both Sides
Fè bak, Carrier : -
Koulè : Blue
Rezistivite tèmik : -
Konductivite tèmik : 1.9 W/m-K