A10874-01 Pricing (USD) [1341PC Stock]
- 1 pcs$32.27547
- 7 pcs$29.20444
- Nimewo Pati:
- A10874-01
- Manifakti:
- Laird Technologies - Thermal Materials
- Detaye deskripsyon:
- THERM PAD 228.6MMX228.6MM WHITE. Thermal Interface Products Tputty 502 30 FG2 9x9" 3W/mK XSoft
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - Thermoelectric, Peltier Modules, Tèmik - tèrmoelèktrik, asanble Peltier, Tèmik - Pwodwi pou Telefòn, Tèmik - tiyo Chalè, Cham vapè, Tèmik - Likid Refwadisman, Tèmik - adezif, epoksi, grès, kole, Fanatik AC and DC Fans ...
- Avantaj konpetitif:
- We specialize in Laird Technologies - Thermal Materials A10874-01 electronic components. A10874-01 can be shipped within 24 hours after order. If you have any demands for A10874-01, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
A10874-01 Atribi pwodwi yo
Nimewo Pati :
A10874-01
Manifakti :
Laird Technologies - Thermal Materials
Deskripsyon :
THERM PAD 228.6MMX228.6MM WHITE
Seri :
Tputty™ 502
Estati Pati :
Active
Itilizasyon :
-
Kalite :
Jar, Sheet
Fòm :
Square
Deskripsyon :
228.60mm x 228.60mm
Pesè :
0.0300" (0.762mm)
Materyèl :
Silicone Elastomer
Adezif :
Tacky - Both Sides
Fè bak, Carrier :
Fiberglass
Koulè :
White
Rezistivite tèmik :
-
Konductivite tèmik :
3.0 W/m-K
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