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Si kote ou pa nan lis la, tanpri chwazi youn nan sa ki annapre yo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
  1. Lakay
  2. Pwodwi yo
  3. Fanatik, tèmik Jesyon
  4. Tèmik - Kousinen, Dra
  5. RE-100-200-05

Taica North America Corporation - RE-100-200-05

KEY Part #: K6152251

RE-100-200-05 Pricing (USD) [3395PC Stock]

  • 1 pcs$12.75928
Nimewo Pati:
RE-100-200-05
Manifakti:
Taica North America Corporation
Detaye deskripsyon:
THERMAL INTERFACE PAD GAP PAD.
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: DC Fans, Tèmik - tèrmoelèktrik, asanble Peltier, Tèmik - Kousinen, Dra, Tèmik - adezif, epoksi, grès, kole, Tèmik - adezif, epoksi, grès, kole, Fanatik - Pwodwi pou Telefòn, Tèmik - Thermoelectric, Peltier Modules and Tèmik - tiyo Chalè, Cham vapè ...
Avantaj konpetitif:
We specialize in Taica North America Corporation RE-100-200-05 electronic components. RE-100-200-05 can be shipped within 24 hours after order. If you have any demands for RE-100-200-05, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

RE-100-200-05 Atribi pwodwi yo

Nimewo Pati : RE-100-200-05
Manifakti : Taica North America Corporation
Deskripsyon : THERMAL INTERFACE PAD GAP PAD
Seri : aGEL™ RE
Estati Pati : Active
Itilizasyon : -
Kalite : Gel Pad, Sheet
Fòm : Square
Deskripsyon : 200.00mm x 200.00mm
Pesè : 0.0200" (0.508mm)
Materyèl : Silicone Gel
Adezif : Tacky - Both Sides
Fè bak, Carrier : -
Koulè : Black
Rezistivite tèmik : -
Konductivite tèmik : 2.0 W/m-K
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