A16104-09 Pricing (USD) [816PC Stock]
- 1 pcs$56.86352
- 4 pcs$48.42355
- Nimewo Pati:
- A16104-09
- Manifakti:
- Laird Technologies - Thermal Materials
- Detaye deskripsyon:
- THERM PAD 228.6MMX228.6MM GRAY. Thermal Interface Products Tflex HR690 9x9" 3.0W/mK gap filler
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Fanatik - Pwodwi pou Telefòn - Fil Fan, Fanatik AC, Tèmik - adezif, epoksi, grès, kole, Fanatik - Pwodwi pou Telefòn, DC Fans, Tèmik - Kousinen, Dra, Tèmik - Thermoelectric, Peltier Modules and Tèmik - Likid Refwadisman ...
- Avantaj konpetitif:
- We specialize in Laird Technologies - Thermal Materials A16104-09 electronic components. A16104-09 can be shipped within 24 hours after order. If you have any demands for A16104-09, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
A16104-09 Atribi pwodwi yo
Nimewo Pati :
A16104-09
Manifakti :
Laird Technologies - Thermal Materials
Deskripsyon :
THERM PAD 228.6MMX228.6MM GRAY
Seri :
Tflex™ HR600
Estati Pati :
Active
Itilizasyon :
-
Kalite :
Gap Filler Pad, Sheet
Fòm :
Square
Deskripsyon :
228.60mm x 228.60mm
Pesè :
0.0900" (2.286mm)
Materyèl :
Silicone Elastomer
Adezif :
Tacky - Both Sides
Fè bak, Carrier :
-
Koulè :
Gray
Rezistivite tèmik :
-
Konductivite tèmik :
3.0 W/m-K
Dènye nouvèl
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