Laird Technologies - Thermal Materials - A17669-014

KEY Part #: K6150922

A17669-014 Pricing (USD) [1273PC Stock]

  • 1 pcs$34.01085

Nimewo Pati:
A17669-014
Manifakti:
Laird Technologies - Thermal Materials
Detaye deskripsyon:
TFLEX UT20350 18 X 18. Thermal Interface Products Tflex UT20350 18 x 18
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - Pwodwi pou Telefòn, Tèmik - Thermoelectric, Peltier Modules, Tèmik - tèrmoelèktrik, asanble Peltier, Fanatik AC, Tèmik - lavabo yo, Tèmik - Likid Refwadisman, Tèmik - Kousinen, Dra and Tèmik - tiyo Chalè, Cham vapè ...
Avantaj konpetitif:
We specialize in Laird Technologies - Thermal Materials A17669-014 electronic components. A17669-014 can be shipped within 24 hours after order. If you have any demands for A17669-014, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

A17669-014 Atribi pwodwi yo

Nimewo Pati : A17669-014
Manifakti : Laird Technologies - Thermal Materials
Deskripsyon : TFLEX UT20350 18 X 18
Seri : Tflex™ UT20000
Estati Pati : Active
Itilizasyon : -
Kalite : Gap Filler Pad, Sheet
Fòm : Square
Deskripsyon : 457.20mm x 457.20mm
Pesè : 0.0140" (0.356mm)
Materyèl : Silicone, Ceramic Filled
Adezif : -
Fè bak, Carrier : -
Koulè : Gray
Rezistivite tèmik : -
Konductivite tèmik : 3.0 W/m-K

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