Nimewo Pati :
BDN12-5CB/A01
Manifakti :
CTS Thermal Management Products
Deskripsyon :
HEATSINK CPU W/ADHESIVE 1.21SQ
Pake refwadi :
Assorted (BGA, LGA, CPU, ASIC...)
Metòd Atachman :
Thermal Tape, Adhesive (Included)
Wotè Off Sèvi (Tay nan Fin) :
0.555" (14.10mm)
Disipasyon pouvwa @ monte tanperati :
-
Rezistans tèmik @ fòse Air koule :
5.20°C/W @ 400 LFM
Rezistans tèmik @ natirèl :
16.50°C/W
Materyèl Fini :
Black Anodized