Nimewo Pati :
B39172B8801P810
Manifakti :
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Aplikasyon :
Cellular, WCDMA
Mounting Kalite :
Surface Mount
Pake / Ka :
5-SMD, No Lead
Wotè (Max) :
0.018" (0.45mm)
Size / dimansyon :
0.043" L x 0.035" W (1.10mm x 0.90mm)