808-AG11D-ES-LF Pricing (USD) [66326PC Stock]
- 1 pcs$0.57280
- 10 pcs$0.50423
- 25 pcs$0.47463
- 50 pcs$0.45489
- 100 pcs$0.43507
- 250 pcs$0.39552
- 500 pcs$0.33673
- 1,000 pcs$0.29931
- 2,500 pcs$0.27125
- Nimewo Pati:
- 808-AG11D-ES-LF
- Manifakti:
- TE Connectivity AMP Connectors
- Detaye deskripsyon:
- CONN IC DIP SOCKET 8POS GOLD. IC & Component Sockets DIP .3CL 08P S&R OFRM AU/SN
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Kat Edge Connectors - adapters, Keystone - Pwodwi pou Telefòn, Tèminal - Barik, Connector bal, Kalite Connectors Pouvwa Kalite - Pwodwi pou Telef, Kowaksyal Connector (RF) - Terminators, Terminals - Quick Connects, Quick Connector dekone, Kontak, Prentan chaje ak chaje and Terminals - May Connectors Fil ...
- Avantaj konpetitif:
- We specialize in TE Connectivity AMP Connectors 808-AG11D-ES-LF electronic components. 808-AG11D-ES-LF can be shipped within 24 hours after order. If you have any demands for 808-AG11D-ES-LF, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
808-AG11D-ES-LF Atribi pwodwi yo
Nimewo Pati :
808-AG11D-ES-LF
Manifakti :
TE Connectivity AMP Connectors
Deskripsyon :
CONN IC DIP SOCKET 8POS GOLD
Seri :
800
Estati Pati :
Active
Kalite :
DIP, 0.3" (7.62mm) Row Spacing
Nimewo nan pozisyon oswa Pins (gri) :
8 (2 x 4)
Pitch - kwazman :
0.100" (2.54mm)
Kontakte Fini - Kwazman :
Gold
Kontakte fini epesè - kwazman :
20.0µin (0.51µm)
Kontakte materyèl - kwazman :
Beryllium Copper
Mounting Kalite :
Through Hole
Karakteristik :
Open Frame
Revokasyon :
Solder
Pitch - Post :
0.100" (2.54mm)
Kontakte Fini - Post :
Gold
Kontakte Fini Epesè - Post :
20.0µin (0.51µm)
Kontakte Materyèl - Post :
Copper
Materyèl Lojman :
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Tanperati :
-55°C ~ 105°C
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