[5553PC Stock]
- Nimewo Pati:
- DIP318-011BLF
- Manifakti:
- Amphenol ICC (FCI)
- Detaye deskripsyon:
- CONN IC DIP SOCKET 18POS GOLD.
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Konektè rektangilè - Housings, Shunts, Jumpers, Sistèm Junction Tèminal yo, Tèminal - Fil Koneksyon Connector, Konektè rektangilè - Tèt, Bèk, Sockets Fi, Solid Eta Lighting Connectors - Kontak, Tèminal Tèminal ak tourèl Boards and Konektè devwa lou - Pwodwi pou Telefòn ...
- Avantaj konpetitif:
- We specialize in Amphenol ICC (FCI) DIP318-011BLF electronic components. DIP318-011BLF can be shipped within 24 hours after order. If you have any demands for DIP318-011BLF, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
DIP318-011BLF Atribi pwodwi yo
Nimewo Pati :
DIP318-011BLF
Manifakti :
Amphenol ICC (FCI)
Deskripsyon :
CONN IC DIP SOCKET 18POS GOLD
Seri :
-
Estati Pati :
Obsolete
Kalite :
DIP, 0.3" (7.62mm) Row Spacing
Nimewo nan pozisyon oswa Pins (gri) :
18 (2 x 9)
Pitch - kwazman :
0.100" (2.54mm)
Kontakte Fini - Kwazman :
Gold
Kontakte fini epesè - kwazman :
10.0µin (0.25µm)
Kontakte materyèl - kwazman :
Beryllium Copper
Mounting Kalite :
Through Hole
Karakteristik :
Open Frame
Revokasyon :
Solder
Pitch - Post :
0.100" (2.54mm)
Kontakte Fini - Post :
Tin
Kontakte Fini Epesè - Post :
200.0µin (5.08µm)
Kontakte Materyèl - Post :
Brass
Materyèl Lojman :
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Tanperati :
-
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