[5502PC Stock]
- Nimewo Pati:
- SIP1X27-001BLF
- Manifakti:
- Amphenol ICC (FCI)
- Detaye deskripsyon:
- CONN SOCKET SIP 27POS GOLD.
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Pouvwa Connectors Antre - Inlets, Plòg, Modil yo, Tèminal - Fil Koneksyon Connector, Tèminal blòk - Distribisyon pouvwa, Terminals - Foil Connectors, Terminals - Pwodwi pou Telefòn, Konektè Fib optik - Kesyon, Kowaksyal Connector (RF) - Kontak and Tèminal - Konektè Fil Splice ...
- Avantaj konpetitif:
- We specialize in Amphenol ICC (FCI) SIP1X27-001BLF electronic components. SIP1X27-001BLF can be shipped within 24 hours after order. If you have any demands for SIP1X27-001BLF, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
SIP1X27-001BLF Atribi pwodwi yo
Nimewo Pati :
SIP1X27-001BLF
Manifakti :
Amphenol ICC (FCI)
Deskripsyon :
CONN SOCKET SIP 27POS GOLD
Seri :
SIP1x
Estati Pati :
Obsolete
Kalite :
SIP
Nimewo nan pozisyon oswa Pins (gri) :
27 (1 x 27)
Pitch - kwazman :
0.100" (2.54mm)
Kontakte Fini - Kwazman :
Gold
Kontakte fini epesè - kwazman :
30.0µin (0.76µm)
Kontakte materyèl - kwazman :
Beryllium Copper
Mounting Kalite :
Through Hole
Karakteristik :
Closed Frame
Revokasyon :
Solder
Pitch - Post :
0.100" (2.54mm)
Kontakte Fini - Post :
Tin
Kontakte Fini Epesè - Post :
200.0µin (5.08µm)
Kontakte Materyèl - Post :
Brass
Materyèl Lojman :
Polyphenylene Sulfide (PPS), Glass Filled
Operating Tanperati :
-
Dènye nouvèl
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