Manifakti :
Omron Electronics Inc-EMC Div
Deskripsyon :
CONN IC DIP SOCKET 8POS GOLD
Kalite :
DIP, 0.3" (7.62mm) Row Spacing
Nimewo nan pozisyon oswa Pins (gri) :
8 (2 x 4)
Pitch - kwazman :
0.100" (2.54mm)
Kontakte Fini - Kwazman :
Gold
Kontakte fini epesè - kwazman :
29.5µin (0.75µm)
Kontakte materyèl - kwazman :
Beryllium Copper
Mounting Kalite :
Through Hole
Karakteristik :
Open Frame
Pitch - Post :
0.100" (2.54mm)
Kontakte Fini - Post :
Gold
Kontakte Fini Epesè - Post :
29.5µin (0.75µm)
Kontakte Materyèl - Post :
Beryllium Copper
Materyèl Lojman :
Polybutylene Terephthalate (PBT), Glass Filled
Operating Tanperati :
-55°C ~ 125°C