BU060Z-178-HT Pricing (USD) [83500PC Stock]
- 1 pcs$0.46827
- 10 pcs$0.41057
- 25 pcs$0.38632
- 50 pcs$0.37027
- 100 pcs$0.33499
- 250 pcs$0.30454
- 500 pcs$0.27408
- 1,000 pcs$0.24363
- 2,500 pcs$0.22079
- Nimewo Pati:
- BU060Z-178-HT
- Manifakti:
- On Shore Technology Inc.
- Detaye deskripsyon:
- CONN IC DIP SOCKET 6POS GOLD.
- Manufacturer's standard lead time:
- Nan stok
- Lavi etajè:
- Yon ane
- Chip Soti nan:
- Hong Kong
- RoHS:
- Metòd peman:
-
- Chemen chajman:
- Kategori Fanmi yo:
- KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Sockets pou ICS, Transistors - cartes, D-Sub, D-ki gen fòm Connectors - backshells, Hoods, Tèminal blòk - Fil Komisyon Konsèy la, Photovoltaic (Solè Panel) Connectors, FFC, FPC (Flat Fleksib) Connectors - Pwodwi pou Te, Tèminal blòk - Distribisyon pouvwa, Konèkteur Backplane - Kontak and FFC, FPC (Flat Flexible) Connectors ...
- Avantaj konpetitif:
- We specialize in On Shore Technology Inc. BU060Z-178-HT electronic components. BU060Z-178-HT can be shipped within 24 hours after order. If you have any demands for BU060Z-178-HT, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
BU060Z-178-HT Atribi pwodwi yo
Nimewo Pati :
BU060Z-178-HT
Manifakti :
On Shore Technology Inc.
Deskripsyon :
CONN IC DIP SOCKET 6POS GOLD
Seri :
BU-178HT
Estati Pati :
Active
Kalite :
DIP, 0.3" (7.62mm) Row Spacing
Nimewo nan pozisyon oswa Pins (gri) :
6 (2 x 3)
Pitch - kwazman :
0.100" (2.54mm)
Kontakte Fini - Kwazman :
Gold
Kontakte fini epesè - kwazman :
78.7µin (2.00µm)
Kontakte materyèl - kwazman :
Beryllium Copper
Mounting Kalite :
Surface Mount
Karakteristik :
Open Frame
Revokasyon :
Solder
Pitch - Post :
0.100" (2.54mm)
Kontakte Fini - Post :
Copper
Kontakte Fini Epesè - Post :
Flash
Kontakte Materyèl - Post :
Brass
Materyèl Lojman :
Polybutylene Terephthalate (PBT), Glass Filled
Operating Tanperati :
-55°C ~ 125°C
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