Laird Technologies - Thermal Materials - A17819-08

KEY Part #: K6150629

A17819-08 Pricing (USD) [115PC Stock]

  • 1 pcs$401.88179

Nimewo Pati:
A17819-08
Manifakti:
Laird Technologies - Thermal Materials
Detaye deskripsyon:
TFLEX HD92000DC1. Thermal Interface Products Tflex HD92000,DC1 18x18IN,
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - tèrmoelèktrik, asanble Peltier, Fanatik - Pwodwi pou Telefòn, Tèmik - tiyo Chalè, Cham vapè, Fanatik AC, Tèmik - Kousinen, Dra, Tèmik - lavabo yo, Fanatik - Pwodwi pou Telefòn - Fil Fan and Tèmik - adezif, epoksi, grès, kole ...
Avantaj konpetitif:
We specialize in Laird Technologies - Thermal Materials A17819-08 electronic components. A17819-08 can be shipped within 24 hours after order. If you have any demands for A17819-08, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

A17819-08 Atribi pwodwi yo

Nimewo Pati : A17819-08
Manifakti : Laird Technologies - Thermal Materials
Deskripsyon : TFLEX HD92000DC1
Seri : Tflex™ HD90000
Estati Pati : Active
Itilizasyon : CPU
Kalite : Gap Filler Pad, Sheet
Fòm : Square
Deskripsyon : 228.60mm x 228.60mm
Pesè : 0.0800" (2.032mm)
Materyèl : Silicone, Ceramic Filled
Adezif : Tacky - One Side
Fè bak, Carrier : -
Koulè : Gray
Rezistivite tèmik : -
Konductivite tèmik : 7.5 W/m-K