Amphenol ICC (FCI) - SIP1X08-001BLF

KEY Part #: K3351445

[11896PC Stock]


    Nimewo Pati:
    SIP1X08-001BLF
    Manifakti:
    Amphenol ICC (FCI)
    Detaye deskripsyon:
    CONN SOCKET SIP 8POS GOLD.
    Manufacturer's standard lead time:
    Nan stok
    Lavi etajè:
    Yon ane
    Chip Soti nan:
    Hong Kong
    RoHS:
    Metòd peman:
    Chemen chajman:
    Kategori Fanmi yo:
    KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Konèkteur Backplane - ARINC, Keystone - Faceplates, kadr, Konektè devwa lou - Kesyon, Hoods, Baz, Tèminal - Konektè Fil Splice, Tèminal - Fil Koneksyon Connector, Konektè Fib optik, Modilè Konektè - krik and Konèkteur Backplane - ARINC Insérer ...
    Avantaj konpetitif:
    We specialize in Amphenol ICC (FCI) SIP1X08-001BLF electronic components. SIP1X08-001BLF can be shipped within 24 hours after order. If you have any demands for SIP1X08-001BLF, Please submit a Request for Quotation here or send us an email:
    GB-T-27922
    ISO-9001-2015
    ISO-13485
    ISO-14001
    ISO-28000-2007
    ISO-45001-2018

    SIP1X08-001BLF Atribi pwodwi yo

    Nimewo Pati : SIP1X08-001BLF
    Manifakti : Amphenol ICC (FCI)
    Deskripsyon : CONN SOCKET SIP 8POS GOLD
    Seri : SIP1x
    Estati Pati : Obsolete
    Kalite : SIP
    Nimewo nan pozisyon oswa Pins (gri) : 8 (1 x 8)
    Pitch - kwazman : 0.100" (2.54mm)
    Kontakte Fini - Kwazman : Gold
    Kontakte fini epesè - kwazman : 30.0µin (0.76µm)
    Kontakte materyèl - kwazman : Beryllium Copper
    Mounting Kalite : Through Hole
    Karakteristik : Closed Frame
    Revokasyon : Solder
    Pitch - Post : 0.100" (2.54mm)
    Kontakte Fini - Post : Tin
    Kontakte Fini Epesè - Post : 200.0µin (5.08µm)
    Kontakte Materyèl - Post : Brass
    Materyèl Lojman : Polyphenylene Sulfide (PPS), Glass Filled
    Operating Tanperati : -

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