t-Global Technology - THINC23-21.5-11.4-5.8-0.8

KEY Part #: K6152147

THINC23-21.5-11.4-5.8-0.8 Pricing (USD) [132184PC Stock]

  • 1 pcs$0.28122
  • 4 pcs$0.27982

Nimewo Pati:
THINC23-21.5-11.4-5.8-0.8
Manifakti:
t-Global Technology
Detaye deskripsyon:
THERM PAD 21.5X11.4MMX5.8MM GRAY.
Manufacturer's standard lead time:
Nan stok
Lavi etajè:
Yon ane
Chip Soti nan:
Hong Kong
RoHS:
Metòd peman:
Chemen chajman:
Kategori Fanmi yo:
KEY Composants Co., LTD se yon Distribitè Eleman Elektwonik ki ofri kategori pwodwi ki gen ladan: Tèmik - adezif, epoksi, grès, kole, DC Fans, Tèmik - Likid Refwadisman, Tèmik - Thermoelectric, Peltier Modules, Tèmik - tèrmoelèktrik, asanble Peltier, Fanatik - Pwodwi pou Telefòn - Fil Fan, Tèmik - adezif, epoksi, grès, kole and Tèmik - tiyo Chalè, Cham vapè ...
Avantaj konpetitif:
We specialize in t-Global Technology THINC23-21.5-11.4-5.8-0.8 electronic components. THINC23-21.5-11.4-5.8-0.8 can be shipped within 24 hours after order. If you have any demands for THINC23-21.5-11.4-5.8-0.8, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

THINC23-21.5-11.4-5.8-0.8 Atribi pwodwi yo

Nimewo Pati : THINC23-21.5-11.4-5.8-0.8
Manifakti : t-Global Technology
Deskripsyon : THERM PAD 21.5X11.4MMX5.8MM GRAY
Seri : THINC
Estati Pati : Active
Itilizasyon : -
Kalite : Interface Cap
Fòm : Rectangular
Deskripsyon : 21.50mm x 11.40mm x 5.80mm
Pesè : 0.0315" (0.800mm)
Materyèl : Silicone
Adezif : -
Fè bak, Carrier : -
Koulè : Gray
Rezistivite tèmik : -
Konductivite tèmik : 1.9 W/m-K